Saturday, July 19, 2014

Top Semiconductor Companies To Watch For 2014

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The Top Ten Stocks for April 10

U.S. stocks rallied, sending the Standard & Poor�� 500 Index to its highest level ever, as China�� imports grew, Japan reiterated its stimulus plans and investors speculated earnings will beat estimates.

All 10 industries in the S&P 500 advanced, with technology and health-care companies rallying more than 1.7 percent. The Nasdaq Composite (CCMP) Index, which counts on computer and software makers for about half its weighting, surged 1.8 percent. Intel Corp. and Micron Technology Inc. jumped at least 2.3 percent as Taiwan Semiconductor Manufacturing Co. predicted a rebound in industry sales. Citigroup Inc. and JPMorgan Chase & Co. added more than 1.2 percent, pacing gains among financial shares.

10 Best Building Product Stocks To Invest In 2015: Celestica Inc (CLS)

Celestica Inc. (Celestica), incorporated on September 27, 1996, is a provider of supply chain solutions globally to original equipment manufacturers (OEMs) and service providers in the communications, consumer, computing and diversified end markets. The Company has operating network in Americas, Asia and Europe. The products and services it provides serve a range of end products, including smartphones; servers; networking, wireless and telecommunications equipment; storage devices; aerospace and defense electronics, such as in-flight entertainment and guidance systems; healthcare products; audiovisual equipment; printer supplies; peripherals; semiconductor capital equipment, and a range of industrial and green technology electronic equipment, including solar panels and inverters. In June 2011, Celestica acquired the semiconductor equipment contract manufacturing operations of Brooks Automation, Inc. In September 2012, the Company acquired D&H Manufacturing Company. D&H is a manufacturer of precision machined components and assemblies, primarily for the semiconductor capital equipment market.

Celestica offers a range of services, including design, manufacturing, engineering, order fulfillment, logistics and after-market services. The Company uses enterprise resource planning and supply chain management systems to optimize materials management from suppliers through to its customers.

Its global design services and solutions architects are focused on opportunities that span the entire product lifecycle. It also leverages its CoreSim Technology to minimize design revisions. It has developed its Green Services to help its customers comply with environmental legislation, such as those relating to the removal of hazardous substances and waste management/recycling. Its services help the customers design, prototype, introduce, manufacture, test, ship, takeback, repair, refurbish, reuse, recycle and properly dispose of end-of-life (EOL) products. Prototyping is a critical early-stage p! rocess in the development of new products. It uses technologies in the assembly and testing of the products. Its failure analysis capabilities concentrate on identifying the root cause of product failures and determining corrective actions. It has a management system that focuses on continual process improvement.

The Company competes with Benchmark Electronics, Inc., Flextronics International Ltd., Hon Hai Precision Industry Co., Ltd., Jabil Circuit, Inc., Plexus Corp. and Sanmina-SCI Corporation.

Advisors' Opinion:
  • [By Seth Jayson]

    Celestica (NYSE: CLS  ) reported earnings on April 23. Here are the numbers you need to know.

    The 10-second takeaway
    For the quarter ended March 31 (Q1), Celestica met expectations on revenues and beat expectations on earnings per share.

Top Semiconductor Companies To Watch For 2014: Universal Display Corp (OLED)

Universal Display Corporation, incorporated on April, 24, 1985, is engaged in the research, development and commercialization of organic light emitting diode (OLED) technologies and materials for use in flat panel display, solid state lighting and other product applications. The Company�� primary business strategy is to develop and license its OLED technologies to product manufacturers for use in these applications. Its primary business is to develop and license its OLED technologies to manufacturers of products for display applications, such as cell phones, portable media devices, tablets, laptop computers and televisions, and specialty and general lighting products; and develop new OLED materials and sell the materials to those product manufacturers. The Company sells its OLED materials to customers for evaluation and use in commercial OLED products. As of December 31, 2012, the Company owns, exclusively license or have the sole right to sublicense more than 3,000 patents issued and pending worldwide. On July 23, 2012, the Company entered into a Patent Sale Agreement (the Agreement) with FUJIFILM. Under the Agreement, FUJIFILM sold more than 1,200 OLED related patents and patent applications.

Phosphorescent Organic Light Emitting Diode Technologies

Phosphorescent OLEDs utilize specialized materials and device structures that allow OLEDs to emit light through a process known as phosphorescence. Traditional fluorescent OLEDs emit light through an inherently less efficient process. Theory and experiment show that phosphorescent OLEDs exhibit device efficiencies up to four times higher than those exhibited by fluorescent OLEDs. Phosphorescence substantially reduces the power requirements of an OLED and is potentially useful in displays for hand-held devices, such as Smartphone��, where battery power is often a limiting factor. Phosphorescence is also important for area displays such as televisions, where higher device efficiency and lower heat generation may enable longer ! product lifetimes and increased energy efficiency.

Additional Proprietary Organic Light Emitting Diode Technologies

Additional OLED Technologies include FOLED Flexible OLEDs, Thin-Film Encapsulation, UniversalP2OLED Printable Phosphorescent OLEDs, OVJP Organic Vapor Jet Printing, OVPD Organic Vapor Phase Deposition and TOLED Transparent OLEDs. The Company is working on a number of technologies required for the fabrication of OLEDs on flexible substrates. As of December 31, 2012, it was conducting research and development on FOLED technologies internally, under several of its United States government programs and in connection with the government-sponsored Flexible Display Center at Arizona State University (ASU). The Company announced its, patented encapsulation technology for the packaging of flexible OLEDs and other thin-film devices, as well as for use as a barrier film for plastic substrates. Its approach for manufacturing a small molecule OLED, including a PHOLED, is based on a vacuum thermal evaporation (VTE) process.

The Company has partnered with Aixtron AG, which is a manufacturer of metal-organic chemical vapor deposition equipment, to develop and qualify equipment for the fabrication of OLED displays utilizing the OVPD process. It has developed a technology for the fabrication of OLEDs that have transparent cathodes. TOLEDs use a transparent cathode and either a transparent, reflective or opaque metal anode.

Organic Light Emitting Diode Materials Supply Business

The Company supplies its proprietary UniversalPHOLED materials to display manufacturers and others. The Company qualifies its materials in OLED devices before shipment in order to ensure that they meet required specifications. During 2012, the Company continued supplying its proprietary UniversalPHOLED materials to SDC for use in its commercial AMOLED display products and for its development efforts. During 2012, the Company also supplied its UniversalPHOLED materials to! LG Displ! ay for use in its commercial AMOLED display products, to Tohoku Pioneer for use in its commercial PMOLED display products, and Konica Minolta for its manufacture of commercial OLED lighting products. During 2012, the Company also supplied its proprietary OLED materials to these and various other product manufacturers for evaluation and for purposes of development, manufacturing qualification and product testing.

The Company competes with Eastman Kodak Company (Kodak), Cambridge Display Technology, Ltd. (CDT), Sumitomo Chemical Company (Sumitomo), Idemitsu Kosan Co., Ltd. (Idemitsu Kosan), Merck KGaA and BASF Corporation.

Advisors' Opinion:
  • [By John Udovich]

    As for potential performance benchmarks or�peers, large cap Corning Incorporated invents, makes, and sells keystone components that enable high-technology systems for consumer electronics, mobile emissions control, telecommunications and life sciences, but the company is probably most well known for its Gorilla Glass, an alkali-aluminosilicate sheet toughened glass cover for portable electronic; small cap�Universal Display Corporation has one of the largest patent portfolios in the organic light emitting diode (OLED) field with licensing rights to over 3000 issued and pending patents worldwide in a broad array of OLED technologies, materials and processes; and small cap GT Advanced Technologies Inc�produces�advanced materials and innovative crystal growth equipment for the global electronics, solar and LED industries.

Top Semiconductor Companies To Watch For 2014: NVIDIA Corporation(NVDA)

NVIDIA Corporation provides visual computing, high performance computing, and mobile computing solutions that generate interactive graphics on various devices ranging from tablets and smart phones to notebooks and workstations. It operates in three segments: Graphic Processing Unit (GPU), Professional Solutions Business (PSB), and Consumer Products Business (CPB). The GPU segment offers GeForce discrete and chipset products, which support desktop and notebook personal computers plus memory products. The PSB segment provides its Quadro professional workstation products and other professional graphics products, including its NVIDIA Tesla high-performance computing products used in the manufacturing, entertainment, medical, science, and aerospace industries. The CPB segment offers Tegra mobile products, which support tablets, smartphones, personal media players, Internet television, automotive navigation, and other similar devices. This segment also licenses video game consol es and other digital consumer electronics devices. The company sells its products to original equipment manufacturers, original design manufacturers, add-in-card manufacturers, consumer electronics companies, and system builders worldwide that utilize its processors as a core component of their entertainment, business, and professional solutions. NVIDIA Corporation was founded in 1993 and is headquartered in Santa Clara, California.

Advisors' Opinion:
  • [By Evan Niu, CFA]

    The analyst is reiterating a "buy" rating on the company while adding a couple bucks to his price target, bringing it to $85. Walkley believes that Qualcomm's core businesses are holding up admirably to recent assaults from Broadcom (NASDAQ: BRCM  ) , Intel, and NVIDIA (NASDAQ: NVDA  ) . In fact, he's even raising his market share estimates.

  • [By Evan Niu, CFA]

    Graphics specialist and mobile chip maker NVIDIA (NASDAQ: NVDA  ) intends to return $1 billion of capital to investors this fiscal year, the company announced today.

Top Semiconductor Companies To Watch For 2014: Advanced Semiconductor Engineering Inc (ASX)

Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.

The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.

Packaging Services

The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).

The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.

The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.

Testing Services

The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.

The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.

Advisors' Opinion:
  • [By Jeff Reeves]

    Advanced Semiconductor Engineering�(ASX) builds and distributes integrated circuits and other electronics. It�� not as sexy as some mobile chipmakers, but thankfully it doesn�� have to be — ASX is simply capitalizing on the general demand for microchips in everything from cars to computers to TVs.

  • [By Namitha Jagadeesh]

    The FTSE 100 Index (UKX) fell 1.31 points, less than 0.1 percent, to 6,679.77 at 10:12 a.m. in London, trimming an earlier decline of as much as 0.6 percent. The gauge has climbed 13 percent this year as central banks maintained stimulus measures to support the global economy. The broader FTSE All-Share Index (ASX) was also little changed today, while Ireland�� ISEQ Index retreated 0.3 percent.

  • [By Seth Jayson]

    Advanced Semiconductor Engineering (NYSE: ASX  ) is expected to report Q2 earnings around July 7. Here's what Wall Street wants to see:

Top Semiconductor Companies To Watch For 2014: NextStage Inc (NXT)

NextStage, Inc. is a holding company. The Company is engaged in the management of its investments in shares of stocks of its subsidiaries. The Company�� subsidiaries include Mondex Philippines Inc. (MXP), Infinit-e Asia Inc. (Infinit-e Asia) and Technology Support Services, Inc. (TSSI). MXP operates a multi-application smart card system in Philippines. Infinit-e Asia is a software development company specializing on smart card and e-commerce solutions tailored to enhance the business of its clients. Infinit-e Asia develops smart card solutions for both real and online applications and on both contact and contactless platform. Infinit-e Asia�� spectrum of products and applications are classified as payments, data capture and security. TSSI is engaged in the business of business process outsourcing (BPO), applications service providers (ASP) and managed service providers (MSP). Advisors' Opinion:
  • [By Namitha Jagadeesh]

    HSBC Holdings Plc (HSBA), Europe�� largest bank, slid 2.1 percent. International Consolidated Airlines Group SA (IAG) declined 2 percent as it canceled some of its flights following a disruption caused by one of its planes at Heathrow airport. Next Plc (NXT) retreated 2.4 percent as Morgan Stanley cut its recommendation on the shares.

Top Semiconductor Companies To Watch For 2014: USmart Mobile Device Inc (UMDI)

USmart Mobile Device Inc., formerly ACL Semiconductors Inc., incorporated on September 17, 2002, the Company is engaged primarily in the business of distributing memory products under the Samsung brand name, which consists of Dynamic Random Access Memory (DRAM), Graphic Random Access Memory (Graphic RAM) and Flash for the Hong Kong and Southern China markets. The primary products the Company distributes and sells include Synchronous Dynamic Random Access Memory (SDRAMs), DDRs (DDR1, DDR2 and DDR3), Flash memory, Graphic RAM and LCD panels. In September 2012, the Company acquired Jussey Investments Limited.

Synchronous Dynamic Random Access Memory (SDRAMs), or mobile SDRAM, are used semiconductor memory component in computer peripherals, such as Hard Disk Drives (HDD), Digital Still Camera (DSC), Modems, ADSL Applications, DVD player, Set-top Box (STB), Digital TV, High Definition TV (HDTV) and Portable Multimedia Players (PMP). DDRs (DDR1, DDR2 and DDR3) are random access memory components that transfer data on both 0-1 and 1-0 clock transitions, theoretically yielding twice the data transfer rate of normal RAM or SDRAM.

Flash memory is a specialized type of memory component used to store user data and program code; it retains this information even when the power is off. Although Flash is predominantly used in mobile phones and tablets, it is commonly used in multi-media digital storage applications for products, such as moving picture experts group layer-3 audio (MP3) players, digital still camera DSC, Digital Voice Recorders, universal serial bus (USB) Disks and Flash Cards. Graphic RAM is a special purpose DDR (GDDR1, GDDR2, GDDR3, GDDR4) that is used in graphic products which require high-speed 3-dimensional calculation performance and a memory size to be used as data storage buffer for digital versatile disc (DVD) and computer game displays. LCD panels are a component in consumer electronics, such as LCD TVs, tablets, smartphones, notebooks, digital phone frames and por! table game consoles.

The Company competes with Toshiba, Hynix, Nanya, PSC, Promos, ISSI and ESMT.

Advisors' Opinion:
  • [By Peter Graham]

    Last Friday, small cap stocks MedCAREERS Group Inc (OTCMKTS: MCGI), USmart Mobile Device Inc (OTCMKTS: UMDI) and Drinks Americas Holdings, Ltd (OTCMKTS: DKAM) were all over the place with the first two sinking 54% and 48.05%, respectively, while the last one rose 10.81%. It should be mentioned that all three small cap stocks have been the subject of paid promotions albeit none of these stocks have been over promoted. So where can investors and traders expect these stocks to head this week? Here is a quick look at what you might expect:

Top Semiconductor Companies To Watch For 2014: Analog Devices Inc (ADI)

Analog Devices, Inc. (Analog Devices), incorporated on January 18, 1965, is engaged in the design, manufacture and marketing of a range of analog, mixed-signal and digital signal processing integrated circuits (ICs). The Company produces a range of products, including data converters, amplifiers and linear products, radio frequency (RF) ICs, power management products, sensors based on micro-electro mechanical systems (MEMS) technology and other sensors, and processing products, including DSP and other processors, which are designed to meet the needs of a base of customers. The Company's products are embedded inside many different types of electronic equipment, including industrial process control systems; instrumentation and measurement systems; wireless infrastructure equipment, and aerospace and defense electronics. The Company designs , manufactures and markets a range of ICs, which incorporate analog, mixed-signal and digital signal processing technologies. The Company's product portfolio includes both general-purpose products used by a range of customers and applications, as well as application-specific products. On March 30, 2012, the Company acquired Multigig, Inc.

Analog Products

The Company's product portfolio includes several thousand analog ICs. The Company's analog IC customers include original equipment manufacturers (OEMs) and customers who build electronic subsystems for integration into larger systems. The Company is a supplier of data converter products. Data converters translate real-world analog signals into digital data and also translate digital data into analog signals. The Company is also a supplier of amplifiers. Amplifiers are used to condition analog signals. The Company provides precision, instrumentation, intermediate frequency/radio frequency (RF), broadband, and other amplifiers. The Company also offers a range of precision voltage references, which are used in a range of applications. The Company's analog product line also includes a range port! folio of RF ICs covering the RF signal chain, from RF function blocks, such as phase locked loops, frequency synthesizers, mixers, modulators, demodulators, and power detectors, to broadband and short-range single chip transceiver solutions.

The Company's RF ICs support the requirements of cellular infrastructure and a range of applications in the Company's target markets. Also within the Company's analog technology portfolio are products, which are based on MEMS technology. This technology enables the Company to build small sensors, which incorporate an electromechanical structure and the supporting analog circuitry for conditioning signals obtained from the sensing element. The Company's MEMS product portfolio includes accelerometers used to sense acceleration, gyroscopes used to sense rotation, inertial measurement units used to sense multiple degrees of freedom combining multiple sensing types along multiple axis, and MEMS microphones used to sense audio. The Company's current revenue from MEMS products is derived from the automotive end market. In addition to the Company's MEMS products, its other analog product category includes isolators. The Company's isolators have been designed for applications, such as universal serial bus isolation in patient monitors, where it allows hospitals and physicians to adopt the advances in computer technology to supervise patient health and wirelessly transmit medical records. In smart metering applications, the Company's isolators provide electrostatic discharge performance. In satellites, where any malfunction can be catastrophic, the Company's isolators help protect the power system while enabling designers to achieve small form factors. Power management & reference products make up the balance of the Company's analog sales. Those products, which include functions such as power conversion, driver monitoring, sequencing and energy management, are developed to complement analog signal chain components across core market segments from micro power, en! ergy-sens! itive battery applications to power systems in infrastructure and industrial applications.

Digital Signal Processing Products

Digital Signal Processing products (DSPs) complete the Company's product portfolio. DSPs are optimized for numeric calculations, which are essential for instantaneous, or real-time, processing of digital data generated, from analog to digital signal conversion. The Company's DSPs are designed to be fully programmable and to execute specialized software programs, or algorithms, associated with processing digitized real-time, real-world data. Programmable DSPs are designed to provide the flexibility to modify the device's function using software. The Company's DSP IC customers write their own algorithms using software development tools provided by the Company and third-party suppliers. The Company's DSPs are designed in families of products, which share common architectures and therefore can execute the same software across a range of products. The Company's customers use the Company's products to solve a range of signal processing challenges across its core market and segment focus areas within the industrial, automotive, consumer and communications end markets. As an integrated part of the Company's customers' signal chain, there are other Analog Devices products connected to its processors, including converters, audio and video codecs and power management solutions.

The Company competes with Broadcom Corporation, Maxim Integrated Products, Inc., Cirrus Logic, Inc., Microchip Technology, Inc., Freescale Semiconductor, Inc., NXP Semiconductors, Infineon Technologies, ST Microelectronics, Intersil Corporation, Silicon Laboratories, Inc., Knowles Electronics, Texas Instruments, Inc. and Linear Technology Corporation.

Advisors' Opinion:
  • [By Harsh Chauhan]

    It is not just auto companies that are benefiting from this growth. Even chipmakers have cashed in on this trend as vehicles get more advanced and are equipped with more technology. Analog Devices (NASDAQ: ADI  ) is one such semiconductor company which has trained its sights on the resurgent auto market. It recently announced the acquisition of Hittite Microwave (NASDAQ: HITT  ) to bolster its position in automotive, along with other verticals.�

  • [By Maria Armental and Tess Stynes var popups = dojo.query(".socialByline .popC"); ]

    Analog Devices Inc.'s(ADI) fiscal second-quarter profit rose 14% as the chip maker reported higher revenue and stronger margins bolstered by secular and seasonal strength in the industrial, communications infrastructure, and automotive markets. Shares rose 1.3% to $52.65 premarket.

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